In this section of Electronic Devices and Circuits.It contain Integrated Circuits MCQs (Multiple Choice Questions Answers).All the MCQs (Multiple Choice Question Answers) requires in depth reading of Electronic Devices and Circuits Subject as the hardness level of MCQs have been kept to advance level.These Sets of Questions are very helpful in Preparing for various Competitive Exams and University level Exams.

This Section covers below lists of topics :

  1. Integrated Circuits MCQs.
  2. Monolithic ICs MCQs.

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1. Monolithic IC consists of:

  • Active components
  • Passive components
  • Both active and passive components
  • None of the above

2. In Monolithic IC:

  • Performance depends on the substrate
  • Performance does not depend on the substrate
  • Performance depends on interconnects
  • Performance depends on packaging

3. Oxidation is used for:

  • Isolation
  • Interconnection
  • Doping
  • None of the above

4. Doping means:

  • Addition of impurity material in semiconductor band structure
  • Removing of impurity material in semiconductor band structure
  • Cleaning the surface
  • None of the above

5. Metallization is used for:

  • Interconnection
  • Protection
  • Packaging
  • None of the above

6. Packaging is used for:

  • Protection
  • Safety
  • Both (a) and (b)
  • None of the above

7. Testing is used for:

  • Checking reliability
  • Quality control
  • Both (a) and (b)
  • None of the above

8. Optical masking is used:

  • Pattern transfer
  • Protection
  • Cleaning
  • None of the above

9. Etching is used for:

  • Selective removal of the unwanted surface
  • Cleaning
  • Interconnection
  • None of the above

10. System on chip means:

  • It consists of both analog and digital IC
  • Only analog IC
  • Only digital IC
  • None of the above

11. Advantages of IC are:

  • Small size
  • Low cost
  • Packing density high
  • All of the above

12. Inductor design in an IC:

  • Is not possible
  • Is possible
  • Is possible with discrete components
  • None of the above

13. Monolithic ICs are

  • Forms of discrete circuits
  • On a single chip
  • Combinations of thin-film and thick-film circuits
  • Also called hybrid ICs

14. Components are soldered together in

  • Discrete circuits
  • Integrated circuits
  • SSI
  • Monolithic ICs

15. For fabrication of integrated circuit silicon is used

  • Since silicon is mechanical strong
  • Since silicon is more conductive semiconductor material
  • Since Silicon possess characteristics which are best suited for IC manufacturing processes
  • Since silicon is black in color

16. the circuit is this the various separately manufactured component

  • suggest transistor, diode capacitors, registers ETC are connected by plated
  • conductors on printed boards are called
  • Integrated circuits
  • Discrete circuits

17. An integrated circuit has extremely

  • Small size
  • Small weight
  • Heavyweight
  • Both a and b

18. To see the connection between the component of an IC, is generally required

  • lenses
  • Telescope
  • Microscope
  • Microphone

19. the most commonly used IC are

  • Monolithic
  • Thin film
  • Thick film
  • Hybrid

20. ICs are generally made of

  • Germanium
  • Silicon
  • Aluminum
  • Ceramic

21. The large scale integrated chip is that which contains circuitry equal to

  • Less than 12 logic gates
  • 12 to 100 logic gates
  • 100 to thousand logic gates
  • Thousand or more than thousand logic gates

22. The SiO2 layer in an IC acts as

  • An insulating layer
  • A conducting layers
  • Barrier in the selective diffusion of impurities in epitaxial layer and protects
  • portion of the water against impurity penetration
  • Both a and c

23. the most important application of an IC is in

  • Computers
  • Simple circuits

24. It is not possible to produce ICS of power rating more than

  • 1 watt
  • 100 watt
  • 10 watt
  • 1000 watts
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